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NG Figure 1

Figure 1. Applications of lasers in materials processing [1]. Operations such as cutting, drilling and etching generally occur on timescales longer than microseconds at low to moderate intensities. Operations such as laser ablation, surface modification and deposition occur on timescales approaching nanoseconds at high intensity. No single laser can perform across the range of intensity and interaction time. The grey boxes shown are more like ‘grey areas’, as many more laser parameters, material properties and interaction pathways have to be considered.
NG Figure 1
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